A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second, opposing surface thereof. Each of the first and second pluralities of bond pads includes an under-bump metallization (UBM) layer. The singulated...http://www.google.com/patents/US7807503?utm_source=gb-gplus-sharePatent US7807503 - Die-wafer package and method of fabricating same
