A method of manufacturing IC devices is applied in forming bumps on an electrode pads to be an input/output terminal of the ICs with a conductive metal layer interposed therebetween. Firstly, a first resist having a prescribed opening is formed over a semiconductor substrate having the electrode pads...http://www.google.com/patents/US5171711?utm_source=gb-gplus-sharePatent US5171711 - Method of manufacturing integrated circuit devices
