In a sputtering apparatus, target particles to be deposited onto a substrate are selectively ionized relative to other particles in the deposition chamber. For example, titanium or titanium-containing target particles are selectively ionized, while inert particles, such as argon atoms, remain substantially...http://www.google.com/patents/US7011733?utm_source=gb-gplus-sharePatent US7011733 - Method and apparatus for depositing films
