Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic...http://www.google.com/patents/US6866255?utm_source=gb-gplus-sharePatent US6866255 - Sputtered spring films with low stress anisotropy
