A chip-on-chip module and associated method of formation. First and second semiconductor chips are coupled together. The first chip comprises a first wiring layer and a first electrically conductive substrate on first and second sides, respectively, of the first chip. A supply voltage VDD is adapted...http://www.google.com/patents/US6635970?utm_source=gb-gplus-sharePatent US6635970 - Power distribution design method for stacked flip-chip packages
