Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface...http://www.google.com/patents/US20060240687?utm_source=gb-gplus-sharePatent US20060240687 - Slanted vias for electrical circuits on circuit boards and other substrates
