An apparatus and method for underfilling a silicon chip (16) to a substrate (12) by depositing an underfill dam (18) on the surface (20) of the substrate (12) prior to addition of the underfill material (14), is disclosed. A bead of underfill material (14) is provided on the substrate (12) about the...http://www.google.com/patents/US5942798?utm_source=gb-gplus-sharePatent US5942798 - Apparatus and method for automating the underfill of flip-chip devices
