A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a portion of the heat sink projects from the package, forming a post. A heat transfer assembly having a...http://www.google.com/patents/US5815921?utm_source=gb-gplus-sharePatent US5815921 - Electronic package cooling system and heat sink with heat transfer assembly 
