A semiconductor build-up package includes a die, a circuit board and at least a dielectric layer. The circuit board has a surface for building up the dielectric layer, and the surface has a cavity for accommodating the die. The inside of multi-layer circuit board has conductive traces for expanding the...http://www.google.com/patents/US6680529?utm_source=gb-gplus-sharePatent US6680529 - Semiconductor build-up package
