The present invention relates to a device of internal probe pads used in failure analysis. The invention provides a circuitry which comprises a plurality of probe pads placed in the last metal layer of a die. Each probe pad is divided into several conductive regions, and each conductive region is selectively...http://www.google.com/patents/US6437364?utm_source=gb-gplus-sharePatent US6437364 - Internal probe pads for failure analysis
