A multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB). Semiconductor dice attached to the top surface of the PCB may be attached by conventional wire bonding, TAB or flip chip methods...http://www.google.com/patents/US6091143?utm_source=gb-gplus-sharePatent US6091143 - Stacked leads-over chip multi-chip module
