A three-dimensional, stacked semiconductor device assembly with microelectronic spring contacts, and components thereof, is disclosed. The assembly comprises a plurality of stacked modules, which are capable of being readily mounted to, and demounted from, one another. Each module of the assembly comprises...http://www.google.com/patents/US6627980?utm_source=gb-gplus-sharePatent US6627980 - Stacked semiconductor device assembly with microelectronic spring contacts
