A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric, a thick second...http://www.google.com/patents/US7443033?utm_source=gb-gplus-sharePatent US7443033 - Post passivation interconnection schemes on top of the IC chips
