A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via openings...http://www.google.com/patents/US5250843?utm_source=gb-gplus-sharePatent US5250843 - Multichip integrated circuit modules
