A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts, and a planarized polymer layer on...http://www.google.com/patents/US6949834?utm_source=gb-gplus-sharePatent US6949834 - Stacked semiconductor package with circuit side polymer layer
