An improved die-mounting paddle for mechanical stress reduction in plastic integrated circuit packages. The paddle, which is incorporated in a leadframe, comprises multiple, coplanar floating sub-paddles, each of which is attached to a support beam by a flexible coil, thus allowing a large die to remain...http://www.google.com/patents/US5021864?utm_source=gb-gplus-sharePatent US5021864 - Die-mounting paddle for mechanical stress reduction in plastic IC packages
