A method of forming a metal layer on a substrate is disclosed. The metal layer is formed using a combined electrochemical plating/electrochemical mechanical polishing (ECP/EMP) process. In the ECP/EMP process, the metal layer is deposited on the substrate by contacting the substrate with a porous pad...http://www.google.com/patents/US20030057097?utm_source=gb-gplus-sharePatent US20030057097 - Method and apparatus for forming metal layers
