An interconnect structure in which a patterned anti-fuse material is formed therein comprising: a substrate having a first level of electrically conductive features; a patterned anti-fuse material formed on said substrate, wherein said patterned anti-fuse material includes an opening to at least one...http://www.google.com/patents/US20010036750?utm_source=gb-gplus-sharePatent US20010036750 - Dual damascene anti-fuse with via before wire
