A semiconductor package is provided. A semiconductor package has a die pad and a plurality of bonding fingers. A spacer is attached to the die pad, and a large die is attached to the spacer. The large die is wire bonded to the plurality of bonding fingers using a plurality of bonding wires. The die pad,...http://www.google.com/patents/US7595551?utm_source=gb-gplus-sharePatent US7595551 - Semiconductor package for a large die
