A probing test method including contacting probe of a probe card with pad on an IC chip on a semiconductor wafer, relatively moving each of the probe along the top of each of the pad, and sending test signal to the pad through the probe. Oxide film on the top of each of the pads can be removed by relative...http://www.google.com/patents/US5436571?utm_source=gb-gplus-sharePatent US5436571 - Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer
