Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump;...http://www.google.com/patents/US7948764?utm_source=gb-gplus-sharePatent US7948764 - Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
