A packaged semiconductor device, leadframe for making same, and method of mounting same to a printed circuit board are described. The device has a body, and a plurality of leads extending from the body. One or more alignment features are formed on the exterior of the package body, for maintaining precise...http://www.google.com/patents/US5521427?utm_source=gb-gplus-sharePatent US5521427 - Printed wiring board mounted semiconductor device having leadframe with alignment feature
