Cost is reduced and reliability is improved with a CSP type semiconductor device. A glass substrate which works as a supporting plate is bonded through an adhesive to a first surface of a semiconductor wafer on which first wirings are formed. Thickness of the semiconductor wafer is reduced by back-grinding...http://www.google.com/patents/US7371693?utm_source=gb-gplus-sharePatent US7371693 - Manufacturing method of semiconductor device with chamfering
