A bonding pad adapted for use with an Aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon...http://www.google.com/patents/US5734200?utm_source=gb-gplus-sharePatent US5734200 - Polycide bonding pad structure
