Methods for assembling a die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. The method includes coupling a first surface of a substrate to a first surface of a heat spreader, mounting a first surface of an IC die to the...http://www.google.com/patents/US20080182364?utm_source=gb-gplus-sharePatent US20080182364 - Integrated Circuit Device Package Having Both Wire Bond and Flip-Chip Interconnections and Method of Making the Same
