A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed...http://www.google.com/patents/US6500760?utm_source=gb-gplus-sharePatent US6500760 - Gold-based electrical interconnections for microelectronic devices
