A charged particle beam uniformly removes material, particularly crystalline material, from an area of a target by compensating for or altering the crystal orientation or structure of the material to be removed. The invention is particularly suited for FIB micromachining of copper-based crystalline structures....http://www.google.com/patents/US6641705?utm_source=gb-gplus-sharePatent US6641705 - Apparatus and method for reducing differential sputter rates
