A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating...http://www.google.com/patents/US20060118953?utm_source=gb-gplus-sharePatent US20060118953 - Semiconductor component having thinned die with conductive vias
