It has been found that selective metallization in integrated circuits is expeditiously achieved through a copper plating procedure. In this process, palladium silicide is used as a catalytic surface and an electroless plating bath is employed to introduce copper plating only in regions where the silicide...http://www.google.com/patents/US5308796?utm_source=gb-gplus-sharePatent US5308796 - Fabrication of electronic devices by electroless plating of copper onto a metal silicide
