The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer attaching...http://www.google.com/patents/US6730997?utm_source=gb-gplus-sharePatent US6730997 - Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device
