The stackable semiconductor chip includes a semiconductor chip having pads on an upper surface thereof, and an adhesive formed on lateral surfaces of the semiconductor chip. A first insulation layer is formed over the upper surface of the semiconductor chip and the adhesive, and defines a plurality of...http://www.google.com/patents/US6188129?utm_source=gb-gplus-sharePatent US6188129 - Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer
