Disclosed is an improved method, system, and computer program product for preparing multiple levels of semiconductor substrates for three-dimensional IC integration. Some embodiments utilize the process and design models to check and fabricate the insulating dielectric layer (IDL) separating the first...http://www.google.com/patents/US7827519?utm_source=gb-gplus-sharePatent US7827519 - Method, system, and computer program product for preparing multiple layers of semiconductor substrates for electronic designs
