In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter...http://www.google.com/patents/US5913109?utm_source=gb-gplus-sharePatent US5913109 - Fixtures and methods for lead bonding and deformation
