A microelectronic substrate and method for removing adjacent conductive and nonconductive materials from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a substrate material (such as borophosphosilicate glass) having an aperture with a conductive material (such...http://www.google.com/patents/US20060208322?utm_source=gb-gplus-sharePatent US20060208322 - Method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate
