A process for filling high aspect ratio gaps on substrates uses conventional high density plasma deposition processes to deposit fluorine-doped films, with an efficient sputtering inert gas, such as Ar, replaced or reduced with an inefficient sputtering inert gas such as He and/or hydrogen. By reducing...http://www.google.com/patents/US6846391?utm_source=gb-gplus-sharePatent US6846391 - Process for depositing F-doped silica glass in high aspect ratio structures
