An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed...http://www.google.com/patents/US5800575?utm_source=gb-gplus-sharePatent US5800575 - In situ method of forming a bypass capacitor element internally within a capacitive PCB 
