The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating...http://www.google.com/patents/US20060001440?utm_source=gb-gplus-sharePatent US20060001440 - Method and system for compensating thermally induced motion of probe cards
