A multi-layered package is disclosed that employs novel shielding techniques to improve high frequency performance of the package. Shield vias are placed near conductive vias to create a two-wire transmission line with controllable characteristic impedance. Controlled transmission line impedance reduces...http://www.google.com/patents/US5338970?utm_source=gb-gplus-sharePatent US5338970 - Multi-layered integrated circuit package with improved high frequency performance
