A multichip module includes: a) a multichip module substrate; b) a first chip, the first chip having opposed base and bonding faces, the base face being adhered to the multichip module substrate, the first chip bonding face including a central area and a plurality of bonding pads peripheral to the central...http://www.google.com/patents/US5323060?utm_source=gb-gplus-sharePatent US5323060 - Multichip module having a stacked chip arrangement
