A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface...http://www.google.com/patents/US6848162?utm_source=gb-gplus-sharePatent US6848162 - System and method of transferring dies using an adhesive surface
