An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant material. An organic compound layer which inherently forms on the substrate during the fabrication of the...http://www.google.com/patents/US6677681?utm_source=gb-gplus-sharePatent US6677681 - Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break
