A semiconductor package has a first conductive via formed through a substrate. The substrate with first conductive via is mounted to a first carrier. A first semiconductor die is mounted to a first surface of the substrate. A first encapsulant is deposited over the first die and first carrier. The first...http://www.google.com/patents/US8008121?utm_source=gb-gplus-sharePatent US8008121 - Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
