Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively...http://www.google.com/patents/US7504615?utm_source=gb-gplus-sharePatent US7504615 - Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
