Techniques are provided for forming die on wafers with large area test structures between primary die. A reticle is used to pattern each die. The pattern on the reticle forms a primary die and test structures in scribelines that abut edges of the die. A reticle can be used to form additional test structures...http://www.google.com/patents/US8003984?utm_source=gb-gplus-sharePatent US8003984 - Reticle for wafer test structure areas
