This invention relates to lead flames upon which chips (A or B) are mounted prior to encapsulation during IC device packaging. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) and four first tie bar portions (16) extending toward...http://www.google.com/patents/US5633528?utm_source=gb-gplus-sharePatent US5633528 - Lead frame structure for IC devices with strengthened encapsulation adhesion
