A wire bonding apparatus for connecting a semiconductor device including a semiconductor chip, to a lead frame having a die pad to which the semiconductor chip is joined, through a plurality of inner leads aligned along a periphery of the die pad at intervals. The apparatus includes a heat block having...http://www.google.com/patents/US6454158?utm_source=gb-gplus-sharePatent US6454158 - Wire bonding apparatus and wire bonding method of semiconductor device
