A semiconductor apparatus includes an insulation tape provided with a device hole therein and a semiconductor chip mounted in the device hole and is provided at a first surface with electrode pads. The apparatus also includes a wiring pattern including leads connected at one ends to the electrode pads;...http://www.google.com/patents/US6437430?utm_source=gb-gplus-sharePatent US6437430 - Semiconductor apparatus and frame used for fabricating the same
