A multipurpose low-thermal-mass radio-frequency chuck for semiconductor device processing equipment (18) and applicable to plasma processing over a wide range of substrate temperatures. The stacked multilayer chuck structure comprises process vacuum base plate (16), heating module (48), cooling module...http://www.google.com/patents/US5192849?utm_source=gb-gplus-sharePatent US5192849 - Multipurpose low-thermal-mass chuck for semiconductor processing equipment
