Process for stripping photoresist from a semiconductor wafer formed with at least one layer of OSG dielectric. The stripping process may be formed in situ or ex situ with respect to other integrated circuit fabrication processes. The process includes a reaction may be oxidative or reductive in nature....http://www.google.com/patents/US6777344?utm_source=gb-gplus-sharePatent US6777344 - Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications
