A chip-stacked semiconductor package and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers, and a heat sink module plate including a plurality of heat sinks are provided, wherein a plurality of through holes are formed around each of the...http://www.google.com/patents/US20060172457?utm_source=gb-gplus-sharePatent US20060172457 - Chip-stacked semiconductor package and method for fabricating the same
